<http://webisa.webdatacommons.org/prov/337963167>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/436530643> .
<http://webisa.webdatacommons.org/436530643>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/436530643>	<http://www.w3.org/ns/prov#value>	"The present invention relates to an apparatus and method for transferring a substrate, such as a wafer or flat panel display, from a robotic transfer arm to a desired location, such as on a processing tool, and in particular for transferring a substrate from a robotic edge grip arm to a chuck on a processing tool." .
<http://webisa.webdatacommons.org/436530643>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/319890082>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/436530643> .