<http://webisa.webdatacommons.org/prov/292035026>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/437823438> .
<http://webisa.webdatacommons.org/437823438>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/437823438>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patentgenius.com> .
<http://webisa.webdatacommons.org/prov/291895256>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/437823438> .
<http://webisa.webdatacommons.org/437823438>	<http://www.w3.org/ns/prov#value>	"Other etching methods may also be used.In one embodiment, the device layer comprises a conductive material, such as a metal or metal alloy, which is patterned into rail shaped electrodes." .