<http://webisa.webdatacommons.org/439115364>	<http://www.w3.org/ns/prov#value>	"A surface 51 a of the first silicon plate 51 is fixedly connected to a first surface 3 b of the circuit chip 3 by means of the adhesive film 4 made of thermosetting or thermoplastic resin such as polyimide or acrylic resin." .
<http://webisa.webdatacommons.org/439115364>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/439115364>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/13047565>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/439115364> .
<http://webisa.webdatacommons.org/prov/368055664>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/439115364> .