<http://webisa.webdatacommons.org/448904836>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/448904836>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/332731173>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/448904836> .
<http://webisa.webdatacommons.org/448904836>	<http://www.w3.org/ns/prov#value>	"FIGS. 3A and 3B are a plan view and a perspective view, respectively, of a semiconductor chip having a stress relieving bump provided on the periphery thereof;" .
<http://webisa.webdatacommons.org/prov/450414109>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/448904836> .
<http://webisa.webdatacommons.org/prov/450404838>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/448904836> .
<http://webisa.webdatacommons.org/prov/333837456>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/448904836> .