<http://webisa.webdatacommons.org/prov/185890465>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/454256693> .
<http://webisa.webdatacommons.org/454256693>	<http://www.w3.org/ns/prov#value>	"Substrates which are suitable for use with the present invention include materials such as ceramic, silicon, porcelain, conventional printed circuit board materials, or other conventional substrates suitable for forming electrical circuits." .
<http://webisa.webdatacommons.org/454256693>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/prov/316406426>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/454256693> .
<http://webisa.webdatacommons.org/454256693>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/352523873>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/454256693> .