<http://webisa.webdatacommons.org/45640221>	<http://www.w3.org/ns/prov#value>	"FIGS. 7(a) and 7(b) are a perspective view and a side view, respectively, showing one of grounding lead terminals 70 in a semiconductor device package in a second preferred embodiment according to the present invention, and FIG. 8 is a plan view" .
<http://webisa.webdatacommons.org/prov/151275828>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/45640221> .
<http://webisa.webdatacommons.org/45640221>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/45640221>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patents.com> .