<http://webisa.webdatacommons.org/prov/245850497>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/48014083> .
<http://webisa.webdatacommons.org/48014083>	<http://www.w3.org/ns/prov#value>	"FIG. 21A is a plan view showing a constitution of a Cu multilayer wiring structure in a pad forming region according to a second embodiment of the present invention;" .
<http://webisa.webdatacommons.org/48014083>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/48014083>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .