. . . "A circular wafer 28 fabricated from semiconductor material, metal or other material is positioned intermediate cleaning pads 11 and 12 in the manner illustrated in FIGS. 1 and 3; provided, however, it is preferred that plates 10, 13 and pads 11, 12 be sized such that the diameter of pads 11 and 12 is sufficient for the pads to extend over a portion of the peripheral edge of wafer 28 and over the c" . .