<http://webisa.webdatacommons.org/5330606>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/5330606>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/482182720>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/5330606> .
<http://webisa.webdatacommons.org/5330606>	<http://www.w3.org/ns/prov#value>	"More particularly, the present invention relates to a method for controlling the types of the intermetallic compounds formed between the SnAgCu solders and the Ni-bearing substrate by adjusting the copper concentration in the SnAgCu solder." .