<http://webisa.webdatacommons.org/54321215>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com.au> .
<http://webisa.webdatacommons.org/prov/231924119>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/54321215> .
<http://webisa.webdatacommons.org/54321215>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/54321215>	<http://www.w3.org/ns/prov#value>	"In addition, the solder layer may comprise a lead-free solder layer, for example, including tin and at least one of silver, bismuth, copper, indium, antimony, gold, and/or zinc, and a weight percent of tin in the solder may be greater than about 95 weight percent." .