<http://webisa.webdatacommons.org/prov/2646225>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/55852813> .
<http://webisa.webdatacommons.org/prov/435876246>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/55852813> .
<http://webisa.webdatacommons.org/55852813>	<http://www.w3.org/ns/prov#value>	"Further, if the semiconductor chip is a light emitting element or a light receiving element, the upper surface of the resin package may be provided with a convex lens portion at a location corresponding to the semiconductor chip." .
<http://webisa.webdatacommons.org/55852813>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/55852813>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .