<http://webisa.webdatacommons.org/prov/420534330>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/56491936> .
<http://webisa.webdatacommons.org/prov/353356681>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/56491936> .
<http://webisa.webdatacommons.org/56491936>	<http://www.w3.org/ns/prov#value>	"Dielectric rings to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the rings on semiconductor devices and other substrates." .
<http://webisa.webdatacommons.org/56491936>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/263392622>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/56491936> .
<http://webisa.webdatacommons.org/56491936>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .