<http://webisa.webdatacommons.org/66250961>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/397891953>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/66250961> .
<http://webisa.webdatacommons.org/66250961>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.fr> .
<http://webisa.webdatacommons.org/66250961>	<http://www.w3.org/ns/prov#value>	"The present invention relates to a semiconductor device and a method of manufacturing it, and more particularly to a method of manufacturing a chip size package." .
<http://webisa.webdatacommons.org/prov/387627567>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/66250961> .