. . . "FIGS. 8A and 8B are a plan view illustrating the step of upsetting the center of a die pad and placing the leadframe on a sheet for encapsulation which is included in the fabrication process of the plastic-encapsulated semiconductor device of the second embodiment, and a cross-sectional view taken along the line VIIIB???VIIIB shown in FIG. 8A, respectively." . .