<http://webisa.webdatacommons.org/prov/317624793>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/94864593> .
<http://webisa.webdatacommons.org/94864593>	<http://www.w3.org/ns/prov#value>	"The present invention is especially effective to the product including the printed circuit board on which electronic parts such as high mounting density packages of QFP, CSP, BGA, and the like or/and flip chip are mounted." .
<http://webisa.webdatacommons.org/94864593>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/94864593>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .