<http://webisa.webdatacommons.org/prov/396589647>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/95174419> .
<http://webisa.webdatacommons.org/prov/397891953>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/95174419> .
<http://webisa.webdatacommons.org/95174419>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patents.com> .
<http://webisa.webdatacommons.org/95174419>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/95174419>	<http://www.w3.org/ns/prov#value>	"The present invention relates to a semiconductor device, and more particularly to a semiconductor device and a method of producing same wherein a connecting terminal portion between a flip-chip and a substrate is improved." .