<http://webisa.webdatacommons.org/96309262>	<http://www.w3.org/ns/prov#value>	"FIGS. 12A and 12B are a side view and a rear view of an IC chip prior to a bonding step of the IC chip mounting method according to the fifth embodiment." .
<http://webisa.webdatacommons.org/prov/246033732>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/96309262> .
<http://webisa.webdatacommons.org/prov/248508805>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/96309262> .
<http://webisa.webdatacommons.org/96309262>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.de> .
<http://webisa.webdatacommons.org/96309262>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .