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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • Conventionally, the material of the package body is made from preformed parts, such as ceramic and occasionally metal, which are then hermetically bonded around the chip, or the material is a plastic and is cast around the chip and the inner portion of the leads in a plastic injection and transfer molding operation.
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