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  • Co., Ltd.Detection of an end point of polishing a substrateUS7004817Aug 23, 2002Feb 28, 2006Micron Technology, Inc.Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpiecesUS7008295Feb 4, 2003Mar 7, 2006Applied Materials Inc.Substrate monitoring during chemical mechanical polishingUS7008296Jun 18, 2003Mar 7, 2006Applied Materials,
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