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  • onductor deviceUS7902648Apr 6, 2006Mar 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915077Jul 28, 2008Mar 29, 2011Micron Technology, Inc.Methods of making metal core foldover package structuresUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providin
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