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  • For example, wiring layer of the multi-layer wiring substrate 1 is formed with the material such as Cu, Al, Ag, Au, or, Su. [0033] The insulating resin or the insulating stress relaxation resin 4 interposed between the semiconductor chip 2 and the multi-layer wiring substrate 1 is formed with any one of epoxy-based resin, silicon-based resin, polyimide-based resin, polyolefin-based resin, cyanate
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