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  • or devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devicesUS8198734 *Aug 31, 2009Jun 12, 2012International Business Machines CorporationSilicon-on-insulator structures for through via in silicon carriersUS8242384Sep 30, 2009Aug 14, 2012International Business Machines CorporationThrough hole-vias in multi-layer printed circ
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