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  • CorporationBall grid array package enhanced with a thermal and electrical connectorUS7902648Apr 6, 2006Mar 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7911037Aug 5, 2009Mar 22, 2011Amkor Technology, Inc.Method and structure for creating embedded metal featuresUS7915718May 17, 2002Mar 29, 20
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