For clarity, the thickness of overcoat 210 is exaggerated in FIG. 2B. As shown, the exposed portions of passivation layer 209 are adjacent to the edges of the die 206A. Overcoat 210 can also be formed of a conductive material such as aluminum or copper, but in that case a nonconductive adhesive layer should be formed between the overcoat and the wafer to ensure that the conductive overcoat does no