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  • or CMOS integrated circuitsUS788017920 Nov 20091 Feb 2011Wafer-Level Packaging Portfolio LlcProcess for making contact with and housing integrated circuitsUS79026486 Apr 20068 Mar 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS791571817 May 200229 Mar 2011Micron Technology, Inc.Apparatus for flip
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