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  • For example, logic and memory devices, such as microprocessors, ASICs, DRAMs and SRAMs, as well as electronic components, such as capacitors, inductors and resistors may be mounted in the carriers 31 instead of or in addition to the LED chips 59. [0074] Furthermore, while a preferred order of fabrication steps was illustrated in FIGS. 2-13, the order of the module fabrication steps may be changed.
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