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  • or device assemblies, packages including the same, and methodsUS791571817 mai 200229 mars 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS79157264 janv. 200829 mars 2011Micron Technology, Inc.Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devicesUS796836928 d???c.
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