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  • 1996Nov 10, 1998Mitsubishi Denki Kabushiki KaishaPacked semiconductor device with wrap around external leadsUS5851845Dec 18, 1995Dec 22, 1998Micron Technology, Inc.Process for packaging a semiconductor die using dicing and testingUS5879965Jun 19, 1997Mar 9, 1999Micron Technology, Inc.Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationUS5883426Apr 18,
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