prov:value
| - oser configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS8125065Mar 5, 2007Feb 28, 2012Micron Technology, Inc.Elimination of RDL using tape base flip chip on flex for die stackingUS8269326Mar 8, 2011Sep 18, 2012Micron Tech
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