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  • on interlayer insulation material; polishing particles containing silicon oxide and dispersed in aqueous solution, and compound such as 1,2,3,4-tetrazole, 5-amino-1,2,3,4-tetrazole, 5-methyl-1,2,3,4-tetrazole, 1,2,3-triazole, 4-amino-1,2,3-triazole, 4,5-diamino-1,2,3-triazoleUS7935242Aug 21, 2006May 3, 2011Micron Technology, Inc.Method of selectively removing conductive materialUS7943519 *Jun 22,
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