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  • 007Nov 16, 2010Micron Technology, Inc.Systems and methods for compressing an encapsulant adjacent a semiconductor workpieceUS7902648Apr 6, 2006Mar 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing te
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