ombined barrier layer and seed layerUS68607988 Ago 20021 Mar 2005Micron Technology, Inc.Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpiecesUS68637977 May 20028 Mar 2005Applied Materials, Inc.Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP