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  • ofiles of semiconductor device assemblies, packages including the same, and methodsUS791038512 May 200622 Mar 2011Micron Technology, Inc.Method of fabricating microelectronic devicesUS791507728 Jul 200829 Mar 2011Micron Technology, Inc.Methods of making metal core foldover package structuresUS791571817 May 200229 Mar 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing ca
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