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  • However, the diazonaphthoquinone-based (DNQ-based) materials have a problem in that these materials considerably reduce the adhesion of the boundary between the insulating resin and chromium, titanium, tungsten, molybdenum, tantalum, vanadium, nickel, and other materials used in the adhesive layer and that the conductive pattern peels away because decomposition products, reaction products, and oth
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