prov:value
| - Nonconductive substrates capable of metal plating using the plating catalyst of the invention include polymers such as polyphenylene oxide, acrylonitrile-butadiene-styrene (ABS) copolymers, polystyrene, polycarbonate, epoxy resins, polyvinyl chloride, polyethylene, polypropylene, polyethylene oxide terephthalate, fluorine polymers such as polytetrafluoroethylene, and other natural and synthetic po
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