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  • ond surfaces, a circuit pattern being formed on said first surface and a mountingUS6516516 *23 juil. 199811 f???vr. 2003Hyundai Electronics Industries Co., Ltd.Semiconductor chip package having clip-type outlead and fabrication method of sameUS65448203 ao???t 20018 avr. 2003Micron Technology, Inc.Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationUS67
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