Some of these components, such as crystals and capacitors, for example, are as thin or thinner than the thickness T of the telephone 20, and are accommodated by placing these components in a cavity formed in the body 22 of the telephone 20, as shown in FIG. 3 which is an enlarged detail of a portion of FIG. 2 and wherein there is illustrated the placement of a component 80 within a cavity in the f