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  • The low melting point solder 5 may also be formed of alloys formed by adding very small amounts of different kinds of metals, for example, Al, Ag, Cu, Ge, and Ni, to the above-mentioned materials in order to improve the metal structure or wettability of the low melting point solder 5 or to prevent the surface of the low melting point solder 5 from being oxidized.
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