prov:value
| - semiconductor die using dicing and testingUS5866939Dec 31, 1996Feb 2, 1999Anam Semiconductor Inc.Lead end grid array semiconductor packageUS5866953May 24, 1996Feb 2, 1999Micron Technology, Inc.Packaged die on PCB with heat sink encapsulantUS5879965Jun 19, 1997Mar 9, 1999Micron Technology, Inc.Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationUS588342
|