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  • Thereafter, though not shown diagrammatically, a low-k material is applied onto the surface of the second interlevel dielectric layer 52, for example, by coating (spin coating), and the material is cured, i.e. hardened by heating to thereby form an insulating film (third interlevel dielectric layer) 60 (see FIG. 1) composed of e.g. the low-k material.
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