prov:value
| - As an injecting method, a method is used in which, after a layer of a material solid-soluble in copper made of a material such as, for example, Ti, Al, Si, Co, B, or P, or a layer of a material solid-soluble in copper including one of those materials as an additive is formed on the copper damascene wiring, the additive is made to diffuse in the copper damascene wiring from the layer of a material
|