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  • sUS5879965Jun 19, 1997Mar 9, 1999Micron Technology, Inc.Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationUS5883426Apr 18, 1997Mar 16, 1999Nec CorporationStack moduleUS5925930May 21, 1996Jul 20, 1999Micron Technology, Inc.IC contacts with palladium layer and flexible conductive epoxy bumpsUS5933713Apr 6, 1998Aug 3, 1999Micron Technology, Inc.Simplifi
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