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  • semiconductor assembliesUS7902648Apr 6, 2006Mar 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS7968989 *Jun 27, 2008Jun 28, 2011Integrated Device Technology, IncMulti-package s
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