prov:value
| - As shown in FIG. 11B, the substrate W plated and processed, as described above, has a plated film 504 grown in the opening 502 a formed in the resist 502. [0070] Thereafter, the dried substrate W is dipped in a solvent, such as acetone or the like, that is maintained at a temperature of 50-60??? C., for example, whereupon the resist 502 is removed from the substrate W, as shown in FIG. 11C. Then,
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