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  • Instead of copper, other metals such as nickel, platinum, gold, or silver may be used for the first layered electrode 141. (4) The spin-coating, drying, and sintering were repeated 40 times toprepare a high-dielectric layer 524 having a thickness of 1.2 .mu.m. (5) Subsequently, a copper layer was formed on the high-dielectric layer 524 using a vacuum deposition system such as a sputtering system.
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