prov:value
| - Mixtures or compounds made from materials such as Au, Ag, Cu, Ni, Fe, Pd, Sn, Pb, Ag, Bi, Zn, In, Sb, Cu, Ge can be also used. [0056] (ASSEMBLING METHOD OF THE SECOND EMBODIMENT) [0057] Next, as shown in FIGS. 17 and 18, an assembling method of the packaging assembly 102 according to the second embodiment of the present invention is described.
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