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  • wafer using variable currents and mass transfer to obtain uniform plated layerUS6179973Jun 30, 1999Jan 30, 2001Novellus Systems, Inc.Apparatus and method for controlling plasma uniformity across a substrateUS6179983Nov 13, 1997Jan 30, 2001Novellus Systems, Inc.Method and apparatus for treating surface including virtual anodeUS6193854Aug 16, 1999Feb 27, 2001Novellus Systems, Inc.Apparatus and metho
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