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  • FIGS. 8A and 8B are a plan view illustrating the step of upsetting the center of the die pad and placing the leadframe on an encapsulation sheet which is included in the fabrication process of the plastic-encapsulated semiconductor device of the second embodiment, and a cross-sectional view taken along the line VIIIB???VIIIB shown in FIG. 8A, respectively.
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