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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • In one embodiment, the backplane comprises an adhesion layer, such as a thin metal like Cr or Ti, or other material configured to withstand soldering temperatures, and solder is deposited on the adhesion layer for attachment of the backplane to the sealant wall.
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