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  • tive polymer of a substrate and filler particle of a group ii salt and within; planarizing a surface on a semiconductor waferUS682118725 Sep 200123 Nov 2004Infineon Technologies AgMethod for chemical-mechanical polishing of a layer which is a substrate and is a metal selected from a platinum groupUS682130922 Feb 200223 Nov 2004University Of FloridaApplying slurry to soft surface layerUS6825117 *14
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